Michael quirk_半导体制造技术-第16章_刻蚀.pptVIP

Semiconductor Manufacturing TechnologyMichael Quirk Julian Serda ? October 2001 by Prentice HallChapter 16 Etch Objectives After studying the material in this chapter, you will be able to: 1. List and discuss eight important etch parameters. 2. Explain dry etch, including its advantages and how etching action takes place. 3. List and describe the equipment systems for seven dry plasma etch reactors. 4. Explain the benefits of high-density plasma (HDP) etch and the discuss the four types of HDP reactors. 5. Give an application example for dielectric, silicon and metal dry etch. 6. Discu