空洞内面研磨器について.ppt

* * superconducting rf test facility STF Mechanical grinding development Ken Watanabe　（KEK） ILWS08 in Chicago 17-Nov-08 STF Content ?Introduction ?About the Grinding Machine ?Grinding Bump location ?Grinding Pit location ?Summary STF Introduction The Kyoto camera system is useful tool for the observation and Shape analysis of spots in cavity inner surface. We obtained a good tool to understand the problem of the cavity surface for achievement a better gradient yield. So far, We understand that heating location of a cavity with low Eacc field has a spot (Bump or Pit) in its inner surface. ( Magnetic field enhancement ) Example : AES#001 hot spots etc… If these spots are removed, then it has possibility that the cavity performance can be improved. HOW TO REMOVE its spot? (Method : CP ?, EP ?, Grinding ?) Intentional scratch ~70μm depth, ~600μm x 1000μm apply 30μm removal by EP Study of scratch removal on Nb surface apply additional (60μm)? removal by local CP apply additional buff polishing using 1.5μm diamond powder small effect small effect well polished 5 min. local CP 20 min. buff polish Effective Scratch don’t remove in EP and CP Not effective STF Grinding machine CCD camera＋LED Grinder Head with Diamond seat Motor 3000 rpm in 12 V (unloaded) Sensor Grinding machine was delivered from company in last week. STF Setup of grinding Ultra pure water Niobium plate Image of CCD camera Bumps Pits Material for grind：Diamond seat #400　(particle size = 40 ~ 60 um), (POLYMOND) Fortunately, the niobium plate has Bumps. The grinding test of bumps was done by using it. As for pits, they were made by my self. grinder Head Diamond particle heat resistance resin STF Bumps looked by Kyoto camera Bumps Size of bumps : diameter = 200～350 um, Height = 20～50um （Checked by laser microscope and Kyoto camera ) Marker line 1mm STF Grinding Bump location (1) Condition (1) Motor speed : 3000 rpm (unloaded) Time : 10 min Reference : Before grinding Bump