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SHIPLEY化学沉铜(SHIPLEY chemical sinks copper)
SHIPLEY化学沉铜(SHIPLEY chemical sinks copper)
SHIPLEY, chemistry, copper,.Txt, cherish life - God still keeps you alive, there must be his plans. Lei Feng does good without seeking recognition, but everything diary. This article is contributed by leilamila
Ppt documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view.
Brief introduction of Shipley chemical precipitation copper and electroplating
The purpose of through-hole plating
Chemical precipitation of copper
The hole wall in the through - catalytic copper deposition provide electrical conductivity. In the hole wall has catalyzed through copper deposition provide electrical conductivity.
Copper plating
Deposition of copper metal by electrolysis in a chemically precipitated copper layer to provide sufficient deposition of copper on a chemically precipitated copper layer by electrolysis,
Electrical conductivity / thickness and the prevention of thermal and mechanical defects in the conductive circuit. Electrical conductivity / thickness and the prevention of thermal and mechanical defects in the conductive circuit
Through hole cross section model
Cross section model of blind hole
SHIPLEY CIRCUPOSIT 200 MLB series
Drilling, CIRCUPOSIT, MLB, leavening agent 211, two stage washing (reflux)
CIRCUPOSIT MLB resin etchant 214
Three stage countercurrent washing
CIRCUPOSIT MLB neutralizer 216
Two stage countercurrent washing
CIRCUPOSIT chemical precipitation process
After drilling
After drilling
CIRCUPOSIT MLB leavening agent 211
The slag on the hole wall is softened and expanded and crosslinked at the crosslinking point after the resin is polymerized so as to reduce the energy of the bonding and make it easy to dissolve the resin.
CIRCUPOSIT MLB except drilling agent 214
Effect: the strong oxidation of Potassium Permanganate, in the high temperature and alkali conditions, and
A chemical reaction occurs when the resin dissolves and dissol
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