原创力文档Application of electron beam lithography to study microcreep deformation and grain boundary sliding：（应用电子束光刻技术研究microcreep变形和晶界滑动）.pdfVIP
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Application of electron beam lithography to
study microcreep deformation and grain
boundary sliding
S. KISHIMOTO, N. SHINYA
National Research Institute for Metals, 1-2-1, Sengen, Tsukuba, Ibaraki 305, Japan
M. D. MATHEW
Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, India
Electron beam lithography has been employed to study microcreep deformation and grain
boundary sliding in pure copper. Fine electron-sensitive microgrids of an alloy of palladium
and gold were developed on the surface of rectangular specimens. Interrupted creep tests
were carried out at 723 K at two stress levels in an argon atmosphere. Creep strain and grain
boundary sliding were determined by forming Moire fringes in a scanning electron
microscope as well as from the displacement of the grid lines. Local distribution of creep
strain inside the grains was found to be non-uniform. Grain boundary sliding exhibited
a wavy behaviour.
1. Introduction
1.1. Principle of electron Moire method
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