封装型式（Package type）.doc

封装型式（Package type） Killer is not cold, 2008-09-20 14:52 Package type has many, here are some abbreviations for your reference! 1.BGA ball grid array package 2.CSP chip scaling package 3.COB chip mount on board Chip mount on 4.COC porcelain substrate 5.MCM multi chip model mount 6.LCC leadless chip carrier 7.CFP ceramic flat package 8.PQFP Plastic Quad lead package 9.SOJ plastic J wire package 10.SOP small outline case package 11.TQFP flat chip square package 12.TSOP micro Book chip package 13.CBGA ceramic solder ball array package 14.CPGA ceramic pin grid array package 15.CQFP ceramic quad flat 16.CERDIP ceramic sealing double row 17.PBGA plastic solder ball array package 18.SSOP narrow spacing small outline plastic sealing 19.WLCSP wafer level chip scale package 20.FCOB flip chip on board The above mentioned excerpts from integrated circuit application magazine, please refer to your counterparts. Among them, the mainstream domestic products to DIP, TSSOP, QFP, SOP and so on. Japan, Taiwan, the United States mainstream products to TSSOP, QFP (more than 100 pins), BGA, CSP and so on. After the packaging form, I think BGA CSP products will become the focus, they will replace QFP become the mainstream of high I/O terminal IC packaging. Add Part Encapsulation refers to the appearance and the position of the solder joint when the actual part is soldered to the circuit board. Is a purely spatial concept, so different components can share the same parts, and the same components can also be packaged in different parts. As a traditional needle type resistance, the element size is large, the circuit board must be drilled to accommodate components, upon completion of the drilling, insert, and tin or tin spraying (or hand welding), high cost, newer designs are used in surface mount small volume type element (SMD) of the element without drilling, steel film semi fused solder paste into the circuit board, and then put on the SMD element, can be welded on the circuit board. Resist