监测表面贴装元件的贴装（Monitoring surface mount component mount）.docVIP

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监测表面贴装元件的贴装（Monitoring surface mount component mount）.doc

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监测表面贴装元件的贴装（Monitoring surface mount component mount）

监测表面贴装元件的贴装（Monitoring surface mount component mount） The desire to increase the circuit density on the PCB continues to be one of the main drivers of the development of SMT technology. This progress includes the use of 0201 sheet packages, dense spaced QFP, high input / output BGA, CSP, and flip chip (flip chip). The use of these components has made stringent demands on the assembly process. In particular, to achieve the desired efficiency and reliability largely depends on the component mount process. More and more SMT lines are using automatic, in-line, post mount inspection tools to monitor the state of the mount process. Inspection after mounting can find defects such as component loss, polarity switching, and component position beyond the specified error. In addition to finding defects, the post mount inspection tool can also examine process changes affecting accuracy, quality, and assembly process efficiency. Corrective action can be taken immediately to minimize the impact of the process by monitoring and identifying changes in the process by monitoring component placement accuracy. This capability requires the use of diagnostic tools for analyzing measurement data, the use of diagnostic requirements, and a comprehensive understanding of the possible sources of errors in the placement process. Template printing process One possible source of mounting errors is the stencil printing process. In particular, the height, area, or volume of the solder paste may affect the accuracy of the mount, due to the lateral movement of the components during the placement of the pins into the solder paste. In order to test this hypothesis, the Institute is located in Georgia (Georgia Tech, Atlanta, GA) circuit board assembly Research Center (CBAR, Center for Board Assembly Research, Sidebar) loading / flip chip assembly line attached to the surface, with a large number of plate. During operation, the squeegee pressure, printing speed, separation (snap-off) interval and detach