Advanced Materials Solutions for 10nm and （10 nm和先进材料解决方案）.pdf

Put the Pieces Together in the Materials Space: Advanced Materials Solutions for 10nm and Beyond Dr. Spencer Tu, Director, Taiwan Technology Center Increasing Interdependency Within the Semiconductor Ecosystem to Meet Performance, Yield and Cost Targets for 10nm and Beyond Opportunity to “put the Customers Care About: pieces together” in the materials space  Technology Performance Device  Process Yield • Advanced precursors,  Device Cost advanced surface preparation, novel doping • Materials, handling, sensing, and delivery components Materials Equipment • Enabling new paradigms Significant overlap within the Semiconductor Ecosystem  Increasing need to work together in this space for advanced solution  Targeted collaborations are key to the challenges advanced node 2 Increased Interaction Among Wet, Deposition, Implant, and Plating Processes When Integrating Materials Materials Process Process Integration Modules BEOL Process Modules MOL Process Modules FEOL Process Modules Understanding the