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Detection of Solder Joint Failure Precursors on (检测焊点失败的前兆)
Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies
using RF Impedance Analysis
Daeil Kwon, Michael H. Azarian, and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742
Phone: 301-405-5323, FAX: 301-314-9269
Abstract of an open circuit, but it is not useful for detecting a partially
degraded interconnect.
During the lifetime of electronic products, interconnects
Degradation of interconnects usually initiates at an
are susceptible to failures by mechanisms such as fatigue,
exterior surface and propagates towards the interior [1][2]. At
creep, corrosion, and mechanical over-stress. Regardless of
frequencies of several hundred MHz or more, signal
the failure mechanisms, interconnect degradation often starts
propagation is more sensitive to the mechanical degradation
from the surface and propagates inward. DC resistance, which
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