MODELLING MATERIAL PROPERTIES OF LEAD （造型材料属性的铅）.pdfVIP

MODELLING MATERIAL PROPERTIES OF LEAD-FREE SOLDER ALLOYS Zhanli Guo*, Nigel Saunders, Peter Miodownik, Jean-Philippe Schillé Sente Software Ltd., Surrey Technology Centre, The Surrey Research Park, Guildford, Surrey, U.K. * z.guo@sentesoftware.co.uk Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, which include liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Youngs modulus, viscosity and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In- 2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of non-equilibrium cooling. The modelling of many of these properties follows well established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multi-component systems, based on the Butler equation. Future software developments are reviewed including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Keywords Material properties, modelling, alloy design, thermodynamics, lead-free solder alloys Introduction To meet the requirements arising from environmental and health issues concerning the toxicity of lead, lead-free solder (LFS) alloys have been developed duri