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基于ATMEGA16的温度测试系统毕业论文
目 次
摘要·····································································································Ⅰ
目次·····································································································Ⅲ
1.绪论·································································································1
1.1.引言·························································································1
1.2.研究内容···················································································4
2.硬件开发平台····················································································6
2.1.开发板的结构原理······································································6
2.2.开发平台基本配置······································································6
2.3.开发平台的基本功能···································································7
2.4.开发板硬件原理图······································································7
2.5.ATMEGA16单片机介绍 ··································································9
2.6.元件清单···················································································10
3.DS18B20温度传感器 ···········································································11
3.1.DS18B20的主要特性 ····································································11
3.2.DS18B20的外形和内部结构 ··························································11
3.3.DS18B20工作原理 ·····································································12
3.4.DS18B20主要数据部件 ·······························································13
3.5.DS18B20温度采集电路 ·······························································14
4.软件的设计·····················································································15
4.1.下位机软件设计·······································································15
4.2.上位机软件设计·······································································17
5.功能调试·····················································
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