ASSEMBLY AND RELIABILITY ASSESSMENT OF （组装和可靠性评估）.pdf

As originally published in the SMTA International Conference Proceedings. ASSEMBLY AND RELIABILITY ASSESSMENT OF FINE PITCH TMV PACKAGE ON PACKAGE (PoP) COMPONENTS 1 2 1 2 2 2 Heather McCormick , Lee Smith , Jimmy Chow , Ahmer Syed , Corey Reichman and CJ Berry 1Celestica Inc. Toronto, ON, Canada 2Amkor Technology Inc. Chandler, AZ, USA hmccormi@ ABSTRACT PoP has seen tremendous growth over the past four and a Since their introduction, package on package components half years following the first adoption in a mobile phone. have proven popular, particularly in handheld portable Recently, industry analysts estimate between 175 and 220 applications. These packages offer significant advantages, million bottom PoP units were shipped in 2008 with over including increased density through stacking of logic and 80% consumed by mobile phones driven by the high silicon memory devices in the same component footprint, and content required in smartphone applications. The first flexibility as a result of the assembler’s ability to select generation bottom PoP technology typically integrates the different memory devices for inclusion in the stack. Next baseband or applicatio