芯片冷却新型集成热管散热器的试验研究-西安交通大学CFD-NHT.PDF

37 7 ( ) Vol. 37 No.7 2009 7 J. H uazhong Univ . of Sci. Tech. ( Natural Science E ition) Jul. 2009 1, 2 2 3 谢旭良 陶文铨 杨洪武 ( 1 长安大学 汽车学院, 陕西 西安710064; 2 西安交通大学能源与动力工程学院, 陕西 西安710049; 3 大连三维传热技术有限公司, 辽宁大连 116025) : , , 2 0. 38 m , . : , 2. 93 m/ s 50 e , 423 W , 0. 118 K/ W, 30 Pa. : ; ; ; ; : TB657. 5 : A : 1671-4512(2009) 07-0054-04 An experimental study of a novel integrated heat pipe- heat sink for chip cooli ng 1, 2 2 3 X ieX uliang Tao Wenquan Yang H ongw u ( 1 School of Aut omot ive, Changcan University, Xican 710064, China; 2 School of Energy an Pow er Engineering, Xican Jiaotong University, Xican 710049, China; 3 Dalian Sunway Heat T ransf er Technique Co Lt , Dalian 116025, Liaoning China) Abstract : T o increase thermal performance of a heat pipe-heat sink for chip cooling, a novel integrate 2 heat pipe-heat sink is presente , w hose con ensercs fins outsi e cooling surface is about 0. 38 m . The time response, pressure rop an heat transfer characteristics of the integrate heat pipe-heat sink w ere investigate by experiment. Results show that the integrate heat pipe-heat sink has high-effec- tive heat transfer performance. With the airflow velocity 2. 93 m/ s an maximum temperature iffer- ence restrict 50 e , the heat sink can issipate 423 W an the correspon ing thermal resistance is only