osp与hasl比较（OSP与HASL比较）.docVIP

osp与hasl比较（OSP与HASL比较） OSP and HASL are the differences between the two surface treatments PCB surface treatment: first, OSP, and two is HASL. What are the differences between the two surface treatments? Under what circumstances is it more reasonable to adopt a surface treatment method, and what are the advantages and disadvantages of the two methods? 1 hot air leveling (HAL) Hot air leveling (HAL) or hot air solder leveling (HASL) is an advanced worker developed in 1980s In the middle and late 90s, it occupied more than 90% of the coating (coating) of the entire PCB surface. Only in the late 90s, due to surface mount technology (SMT) development, the HAL in the PCB share rate gradually decreased, but the HAL on the surface of PCB coating (plating) covering the share is still at about 50%. Despite the high density development of SMT will make HAL application probability in PCB decreased, but the application of HAL technology in the production of PCB is still a very long life, even disable lead solder (green lead-free solder), lead-free HAL technology will be developed and applied. 1.1 hot air leveling process and Application Hot air leveling technology refers to the PCB (usually in the system board panel) dipped in the molten eutectic (183 DEG C, as shown in Figure 1 (Sn/Pb) ratio should be equal to or close to 63/37, the operation temperature is 230 to 250 DEG) in the alloy, and then pull Fig. 1 Composition of tin / lead alloy The hot air (control air temperature, wind speed and wind blade angle, the blade structure and PCB plate distance has been optimized and fixed) to blow Sn/Pb alloy redundant, Sn/Pb alloy layer composition and thickness required. To control and maintain good Sn/Pb alloy compositions in the proportion of hot air leveling production process (usually regular pure tin, because it is easier to lead tin oxide, and tin are easy to form alloys with other metals, so tin consumption faster than lead). At the same time, in the process of high temperature