bga芯片焊接（BGA chip bonding）.docVIP

bga芯片焊接（BGA chip bonding） With the volume of mobile phones becoming smaller and smaller, the internal integration is getting higher and higher, and now almost all of the mobile phone using the ball grid array packaging module, that is, we usually call the BGA. This module is welded to the motherboard in the form of patches. For maintenance personnel, proficiency in hot air guns has become a required course to repair such modules. 1. The degree of heat resistance of the BGA module and the regulation technique of the hot blast gun temperature. The BGA module uses the entire bottom of the package to connect to the circuit board. Not soldered by pins, but soldered by solder balls. Module size, mobile phone is relatively reduced the volume, but the package module also determines the relatively easy to weld the characteristics of mobile phone manufacturers in order to reinforce this module, often use the glue method. This increases the difficulty of maintenance. To deal with this glue seal module, we have to use the hot air gun to blow a long time to remove the module, often in the process of blowing welding, welding temperature control is not good, and the module is also damaged because of the high temperature. Then how to adjust the temperature of the air gun effectively?. If you can pull down the module, you cant damage it! To tell you that several types of BGA modules commonly used in the heat-resistant temperature and welding should pay attention to matters. Motorola V998 CPU, we must be very familiar with it, most of this module is encapsulated in rubber. This module is relatively high degree of heat, air gun temperature less than 400 degrees will not damage it, we can adjust the temperature of the air gun to 350-400 degrees desoldering, uniform heating of the surface, when the ball out of the CPU, that has all the solder under the melt, then you can use tweezers to gently pry it, thereby safely removed. With this module of the welding method, almost the module also