dual mode sensing with low-profile piezoelectric thin wafer sensors for steel bridge crack detection and diagnosis双模式与低调的压电薄圆片传感器传感钢桥裂纹检测和诊断.pdfVIP

Hindawi Publishing Corporation Advances in Civil Engineering Volume 2012, Article ID 402179, 10 pages doi:10.1155/2012/402179 Research Article Dual Mode Sensing with Low-Profile Piezoelectric Thin Wafer Sensors for Steel Bridge Crack Detection and Diagnosis Lingyu Yu,1 Sepandarmaz Momeni,2 Valery Godinez,2 Victor Giurgiutiu,1 Paul Ziehl,3 and Jianguo Yu3 1 Department of Mechanical Engineering, University of South Carolina, Columbia, SC 29208, USA 2 Mistras Group Inc., 195 Clarksville Road, Princeton Junction, NJ 08550, USA 3 Department of Civil Engineering, University of South Carolina, Columbia, SC 29208, USA Correspondence should be addressed to Lingyu Yu, yu3@ Received 30 May 2011; Accepted 6 September 2011 Academic Editor: Piervincenzo Rizzo Copyright © 2012 Lingyu Yu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Monitoring of fatigue cracking in steel bridges is of high interest to many bridge owners and agencies. Due to the variety of deterioration sources and locations of bridge defects, there is currently no single method that can detect and address the potential sources globally. In this paper, we presented a dual mode sensing methodology integrating acoustic emission and ultrasonic wave inspection based on the use of low-profile piezoelectric wafer active sensors (PWAS). After introducing the research background and piezoelectric sensing principles, PWAS crack detection in passive acoustic emission mode is first presented. Their acoustic emission detection capability has been validated through both static and compact tension fatigue tests. With the use of coaxial cable wiring, P