design methodology for the micronozzle-based electrospray evaporative cooling devices设计方法论micronozzle-based喷雾蒸发冷却设备.pdfVIP

Journal of Electronics Cooling and Thermal Control, 2012, 2, 17-31 / 10.4236/jectc.2012.22002 Published Online June 2012 (http://www.SciRP.org/journal/jectc) Design Methodology for the Micronozzle-Based Electrospray Evaporative Cooling Devices 1 2 Hsiu-Che Wang , Alexander V. Mamishev 1Mechanical Engineering, University of Washington, Seattle, United States 2Electrical Engineering, University of Washington, Seattle, United States Email: hsiuchew@, mamishev@ Received April 19, 2012; revised May 23, 2012; accepted May 29, 2012 ABSTRACT Thermal management of microelectronics demands higher heat flux removal capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray evaporative cooling (ESEC) is a potential package-level thermal management solution for the next generation of microelectronics. In this paper, a design methodology is presented using numerical electrostatic field modeling to indirectly design proof-of-concept, micronoz- zle-based ESEC chambers. The results of the numerical modeling and heat transfer experiments indicate that the poten- tial distribution near the micronozzle tip of the ESEC chamber dominates the heat transfer performance of ESEC cool- ing devices. The surface charge density at the micronozzle tips has a minor impact on the heat transfer performance. The maximum enhancement ratio of 1.87 was achieved by the 8-nozzle ESEC chamber at the lowest heat flux investi- gated, indicating that the heat transfer capability of ESEC chambers declines as the heat source density increases. The study demonstrates that increasing the number of micronozzles and decrea