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pcb多层板布线方法(PCB multi board wiring method)
pcb多层板布线方法(PCB multi board wiring method)
It was announced at 21:48
* * four circuit board wiring method: in general, the four circuit board can be divided into the top layer, the bottom layer and the two intermediate layer. Signal line between top and bottom,
The middle tier first adds INTERNAL, PLANE1, and INTERNAL PLANE2 by using the command DESIGN / LAYER STACK MANAGER with ADD PLANE
As the most power layer used, such as VCC and formation, such as GND (that is, the corresponding network label is connected. Be careful not to use ADD LAYER, which will increase
Plus MIDPLAYER, which is mainly used for multilayer signal line placement, so that PLNNE1 and PLANE2 are two layers of connection power VCC and ground copper GND.
If there are multiple power supplies, such as VCC2, or formations such as GND2, first use a thicker wire or fill FILL in PLANE1 or PLANE2 (at this time)
The copper wire corresponding to the line or FILL does not exist, the conductor can be clearly seen or visible to the light) to delineate the approximate area of the power or ground
(mainly for the convenience of the following PLACE / SPLIT PLANE command), and then use PLACE / SPLIT PLANE in INTERNAL PLANE1 and
In the corresponding region of INTERNAL PLANE2, the area (i.e., VCC2 copper crust and GND2 copper sheet) is delineated in this region, and there is no VCC in this region in the same PLANE
Range (note that the layers of different networks in the same PLANE do not overlap as much as possible. Let SPLIT1 and SPLIT2 overlap two blocks in the same PLANE,
And SPLIT2 in the SPLIT1, the seihan will automatically separate the two pieces according to the borders of the SPLIT2 (SPLIT1 is distributed outside the SPLIT).
Just pay attention to the pads or vias on the same network table that overlap with SPLIT1, and dont try to connect to the SPLIT1 in the area of SPLIT2
Out of question. At this time, the vias in the area are automatically connected with the copper sheath corresponding to the layer, and th
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