ERSA IR 550 A Advanced technology for safe （550年ERSA红外先进的安全技术）.pdfVIP

ERSA IR 550 A Advanced technology for safe SMT Rework A. Uniform heating using controlled IR radiation The ERSA IR Rework systems use medium wavelength IR radiators, emitting radiation in the range of 2 to 8 µm. The absorption/reflection ratio of these radiators is optimised for PCB manufacturing and rework thereby guaranteeing a minimal ∆T. During the reflow process, the heat distribution for small components and large components is uniform. Temperature differences between a small adjacent chip and a large BGA, for example, can be reduced by the choice of the appropriate temperature profile and the optimal preheating time. The patented aperture system of the ERSA IR top radiators reduces the irradiation of neighbouring components depending on their distance. A complete shielding, however, is possible as discussed below in part D. IR heat distribution over component borders (source: ERSA GmbH, 1999) 27 mm B. SMT Production conditions for multiple reflow During a typical reflow manufacturing process of a double sided SMT PCB, two reflow cycles or even up to three heating cycles are standard. Industry standards and scientific data accept this multiple reflow process as having absolutely no measurable negative effect to the long term reliability of the soldered connection. The most obvious effect of too many and/or too hot heating cycles is the growth of the intermetallic tin-copper layers. As seen in the table below, during as many as 1 five repair cycles, the intermetallic layer increases by only 1µm. This increase, as discussed in part C below, however, is inconsequential to the joint stability.