Semiconductor and Advanced Assembly Materials（半导体和先进的组装材料）.pdf

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Semiconductor and Advanced Assembly Materials（半导体和先进的组装材料）.pdf

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Semiconductor and Advanced Assembly Materials（半导体和先进的组装材料）

Semiconductor and Advanced Assembly Materials Semiconductor and Advanced Assembly Materials Wafer Bumping Fluxes: Indium Corporation’s Semiconductor-Grade Wafer Bumping Fluxes are applied by jetting or dispense, followed by spin-coating to optimize film thicknesses. Reflowed in very low (10ppm) oxygen/nitrogen atmosphere, these fluxes convert rough, non-spherical plated or wafer probe-dented solder bumps into shiny spheres. Proven applications include both copper pillar microbumps and standard bumps from plated, reflowed solder paste or ball drop processes. Flux Flux Flux Application Target Cleaning Halogen- Roadmap or Type Type Method Description Application Method free? Material released product? Wafer Bumping Liquid flux for reflow of High Pb; Eutectic Solvent or aqueous- Flux SC Spin coating solder bumps on UBM (63Sn/37Pb); SnAg based chemistry YES: NIA Wafer Flux SC-5R Released Q3, 2011 Cleanable with warm Wafer Bumping Liquid flux for reflow of Wafer Flux WS3401, Flux WS Spin coating solder bumps on UBM SnAg solder bumps DI water only (no YES: NIA WS3543 Released Q2, 2009