印制电路板各工序缺陷中英文一览.docVIP

Inner layer dry/film 内层干菲林 Blocking boards 卡板 Lack copper 少铜 Inner scrap 内层报废 Uncomplete tearing film 撕膜不净 Soft inner 内层变软 Conductor lift 崩线 Inner misregistration 内层错位 Bulge on conductor 线路凸位 Inner short 内层短路 Poor conductor 线路不良 Inner open 内层开路 Pattern misregistration 线路图形歪 Inner slight short 内层微短 Elliptical hole 椭圆孔 Pressing 压板 DRY PLY DRY PLY Inner shift 内层偏位 Tg value out of spec. Tg超出要求 Inner hole position incorrect 内层歪孔 Tg value not meet the requirement Tg达不到要求 Lay up in reverse 排反板 Dent 凹折 The incision length not meet the requirement 切割长度达不到要求 Measling 白斑 Board poor cutting 切坏板 Poor edge 板边不良 Burnt 烧焦 Burrs on board edge 板边毛刺 The resin content lower than the requirement 树脂含量低于要求 Resin shortage in board edge 板边缺树脂 Void in resin 树脂空洞 Fibre in board edge 板边纤维丝 Dissipation factor beyond criteria 损耗因子达不到要求 Thin board thickness 板薄 Make wrong guide hole 挑错管位 Excess board thickness 板厚 Thinner copper thickness 铜箔偏薄 Board out of spec. 板厚不合要求 Dlamination between surface copper and prepreg 铜箔气泡 Lamination wrinkles 板料布纹 Bow and twist out of spec 弯曲性超标 Lamination blisters 板料气泡 Dusty and damage 污损 Rough board surface 板面不光滑 Absorption beyond criteria 吸水性超标 Board surface extrusion 板面突起 Construction of fiber not meet requirement 纤维结构不符要求 Dent by pressing board 板面压伤 Pressing dent 压板凹痕 Board warp/bow 板弯/曲 Poor lamination 压板不良 Board small 板小 Failed pressure vessel test 压力锅测试未达标 Protective film too thick or thin 保护膜偏厚偏薄 Fracture 压伤 Delamination 爆板 Oxide 氧化 Peel strength under requirement 剥离强度未达标 Misuse prepreg 用错P片 Black oxide scratch 擦花黑化 Laminate misused 用错板料 Layer structure not meet MI requirement 层压结构不符MI要求 Misuse inner P/R 用错内层P/R Poor dimensional stability 尺寸稳定性未达标 Misuse Cu coil 用错铜箔 Delamination/Blister 分层/起泡 Weave texture 织纹显露 Poor cutting 割板不良 Wrinkles 皱折痕 Guide hole over size 管位大孔 Marked legend shift 字唛打偏 Guide pin shift 管位钉打偏 Marked legend in unit 字唛入单元 Guide hole shift 管位歪孔 Stain on board 板面污渍 Poor black oxide 黑化不良 Bow 板弯 Bo