PCB板无铜原因分析深联电路板.doc

PCB板孔无铜原因分析—深联电路 作者：深圳市深联电路有限公司 PCB板孔无铜是印制电路板厂普遍头痛的问题，此种不良属于功能性问题，是深联电路一直严格监控关键点，同时，把好每道工序的品质检验关，以防不良品流出。下面印制电路板厂将对PCB板孔无铜的原因做简要分析。 一、鱼骨图分析孔无铜产生原因 二、案例分析 钻孔导致的孔无铜 孔未钻穿造成的孔无铜，切片特征：孔口有底铜未钻穿 有钻咀断在孔内导致的孔无铜，切片特征：孔内有明显的断钻咀 孔内残留钻粉导致的孔无铜 2、沉铜孔无铜 整体图 沉铜气泡导致的孔无铜，切片特征：断铜较对称，且图电层比板电层长。 板电孔无铜 整体图 特写图，板电气泡导致的孔无铜，切片特征：面铜及孔内铜层都偏薄，孔内板电层从孔口至断口处呈拉尖趋势，且断口处板电层被图电层包裹住；孔内板电铜薄孔无铜---面铜板电层正常，但孔壁板电层从孔口至断口处呈拉尖趋势，且断口处板电层被图电层包裹住 4、D/F孔无铜 在D/F的制作过程中，孔中塞有火山灰或膜渣等异物，图电时影响药水的贯孔性能而产生孔无铜，或孔壁上沾有膜类油状物等抗镀物质，在电镀时影响镀铜及镀锡，蚀刻后产生孔无铜，切片特征：孔口两段板电铜及图电铜断口整齐，图电层未将板电层包住；或孔口一端断口拉尖，另一端断口整齐，图电层未将板电层包住。 5、图电孔无铜 整体图1 特写图1 整体图2 特写图2 图电镀锡不良导致的孔无铜，切片特征：断铜较对称或板电与图电层断口较整齐，图电层未将板电层包住，即板电层比图电层长。 implementation of corrective tasks for the new problems found in a timely manner into the special rectification and rectification category. In-depth summary of good practices and good experience in educational practice, good around the typical, continue to promote the rectification, to prevent repeated rebound, use of the results of the activities, timely organization look back again. The theoretical results, continuously consolidate and deepen and expand educational practice to achieve the system results, practical results. Three, the main problems and rectification measures focus on rectification goals, determined to honor the commitment rectification measures to build long-term mechanism style construction bureau Party, improve the ideological style The construction and working level, according to the list of issues to sort it out, with overall requirements to carry out the mass line of educational activities, focus on the implementation of the rectification, enhance team ability to discover and solve their own problems, focus on building a political firm, pioneering and innovative, wholeheartedly for the people, strive for unity, harmony, strong collective leadership (a honest and clean.) there lack of global awareness and innovation probl