常用电子元件封装（Packaging of common electronic components）.docVIP

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常用电子元件封装（Packaging of common electronic components）.doc

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常用电子元件封装（Packaging of common electronic components）

常用电子元件封装（Packaging of common electronic components） Packaging of common electronic components Resistors: RES1, RES2, RES3, RES4; the package attribute is axial series Non-polar capacitor: cap; the package property is RAD-0.1 to rad-0.4 Electrolytic capacitor: electroi; the package property is rb.2/.4 to rb.5/1.0 Potentiometer: Pot1, pot2; encapsulation property is VR-1 to vr-5 Diode: the package property is diode-0.4 (small power) diode-0.7 (high power) Triode: common packaging properties for TO-18 (ordinary triode), to-22 (high-power transistor), TO-3 (high-power Darlington tube) The power regulator blocks have 78 and 79 series; the 78 series, such as 780578127820, etc. The 79 series has 790579127920 Common encapsulation attributes are to126h and to126v Rectifier bridge: BRIDGE1, BRIDGE2: package attributes for the D series (D-44, D-37, D-46) Resistance: AXIAL0.3-AXIAL0.7, where 0.4-0.7 refers to the length of resistance, usually AXIAL0.4 Ceramic capacitors: RAD0.1-RAD0.3. Where 0.1-0.3 refers to the size of the capacitor, usually RAD0.1 Electrolytic capacitor: RB.1/.2-RB.4/.8, where.1/.2-.4/.8 refers to the size of capacitors. General 100uF use RB.1/.2100uF-470uF uses RB.2/.4, 470uF uses RB.3/.6 Diode: DIODE0.4-DIODE0.7, in which 0.4-0.7 refers to diode length, generally used DIODE0.4 Light emitting diode: RB.1/.2 Integrated block: DIP8-DIP40, where the 8-40 finger has many feet, and the 8 foot is the DIP8 chip resistor 0603 indicates that the package size has nothing to do with the specific resistance, but the package size is related to power, usually as follows: 0201 1/20W 0402 1/16W 0603 1/10W 0805 1/8W 1206 1/4W What is the relation between the capacitance and the shape of the resistor and the package?: 0402=1.0mmx0.5mm 0603=1.6mmx0.8mm 0805=2.0mmx1.2mm 1206=3.2mmx1.6mm 1210=3.2mmx2.5mm 1812=4.5mmx3.2mm 2225=5.6mmx6.5mm Part Encapsulation refers to the appearance and the position of the solder joint when the actual part is soldered to the circuit board. Is a p