过孔(via)（过孔（通过））.docVIP

过孔(via)（过孔（通过）） I. vias (via) Through hole (via) is one of the important components of multilayer PCB, and the cost of drilling usually accounts for 30% to 40% of the cost of PCB board. In brief, each hole on the PCB can be called vias. From the point of view of function, vias can be divided into two categories: one is used as an electrical connection between the layers, and two is used as a device for fixing or positioning. If the process from the process, these vias are generally divided into three categories, namely blind hole (blind, via), via (buried) and through hole (through via). The blind hole is located on the top and bottom surface of the printed circuit board and has a depth that is used for the connection of the surface line and the inner line below. The depth of the hole usually does not exceed a certain ratio (Kong Jing). A buried hole means a connecting hole in the inner layer of a printed circuit board, which does not extend to the surface of the circuit board. The two types of holes are located in the inner layer of the circuit board, and are completed by using the through hole forming process before lamination, and may be overlapped in the process of hole formation, so as to make a few inner layers. The third is called through holes, which pass through the entire circuit board and can be used for internal interconnection or as mounting holes for components. Since vias are easier to implement and lower in cost, most printed circuit boards use it without two other vias. The vias mentioned below, without special instructions, are considered as vias. From the design point of view, an over hole is made up of two main parts, one is the middle hole (drill hole), and the other two is the pad area around the borehole. The size of these two sections determines the size of the vias. Obviously, at high speed, High density PCB design, designers always hope through holes as small as possible, so the board can have more wiring space, in addition, a hole is small