SEM与X-ray能量分散元素分析仪器暨EDS原理.pptVIP

Case .1 The purities remains at the pin by SEM check Case .2 The cladding separation occurring Case .3 The purities residual at the soldering . Case .4 The failure soldering causes by the pin raising. Case .5 The crack is found by the SEM analysis Case .6 The crack is found by the SEM analysis Case .7 To observe the crack morphology . Case .8 Wire-Bonding is not connected with pad. SEM Application: Non Cross-Section Sample Case (High Depth of Field, High Resolution, No Optical Interference.) 5. SEM/EDS分析案例與應用： Case .9 The failure soldering is found by the SEM analysis Case .10 Bonding wire is connected well with pad. But some purities remain at the Die Attach. Case .11 The BSE image (shown as left figure) can display the shading , and the SEM image can show ragged Case .12 The BSE image (shown as left figure) can display the shading , and the SEM image can show ragged SEM Application: Non Cross-Section Sample Case (High Depth of Field, High Resolution, No Optical Interference.) * SEM與X-ray能量分散元素分析儀暨EDS原理 Outline: 1. Introduction 2. 基本原理 3. SEM構造與功能 4. EDS構造與功能 5. SEM/EDS分析案例與應用 1. Introduction: 1-1 掃描式電子顯微鏡 (Scanning Electron Microscopy, SEM) 是利用電子束成像的原理, 來看微觀的世界。其特點是試片製作簡易。 空間解析超高(可逼近1 nm)，且具有看到物體之立體樣貌的能力 比較 1-2 能量散佈分析儀(Energy Dispersive Spectrometer, EDS) 主要功能為成分分析。搭配SEM則可量測微小區域的成份。 1-3 SEM+EDS 可分析的範圍: Scanning Electron Microscope / Energy Dispersive X-Ray Micro Analyzer A. Model: HITACHI S-3000N. / HORIBA EX-220. (In-house : SFA) B. Equipment Capability: SEM 1) Analysis Type: SE, BSE 2) Image Resolution: 3.0nm (SE), 4.0nm (BSE) 3) Specimen Chamber: 150mm. 4) Image Magnification: x15 - x300000. 5) Specimen Tile / Rotation: -20 - +90o. / 360o. 6) Acceleration Voltage: 0.3 - 30 KV. 7) Analysis Capability: High Mag. Resolution Inspection for Each Types of components,