应用DLP为基相移技术於球格阵列锡球之三维量测.PDF

應用 DLP 為基相移技術於球格陣列錫球之三維量測 3D BGA solder balls measurement using DLP-based phase shifting technique 計畫編號： 94/08/01~95/07/31 執行期限：NSC94-2213-E-129 -008 主持人：顏旭男 聖約翰科技大學電子系 副教授 一、中文摘要關鍵詞：三維量測、相( process. 3D measurement systems based 位移、球格陣列、錫球、數位光學 on X-ray or laser scanning techniques are 處理) expensive and need time-consuming calibration process. This project aims to 在表面黏著封裝製程中，三維量測 the quality inspection of BGA chips to develop a cost-effective and fast 3D 對球格陣列（Ball Grid Array ）晶片的品 measurement system. The proposed 質檢測相當重要。基於 X射線（ X-ray ） system will be based on a phase 或雷射掃瞄（ Laser scanning ）方法的精 measuring technique, in which the phase 密三維量測系統，不僅建置成本高，且 will be efficiently and effectively shifted 系統校正耗時費力。本研究所發展之三 by a software-controlled grating using a 維量測系統，其利用可程式控制的數位 digital light processing (DLP) projection 光學處理 (Digital Light Processing)單 unit. A sinusoidal fringe pattern is projected on the object, and deformed in 元產生數位光柵圖樣，經共面白光照射 accordance w