晶圆探针测试之温度影响探讨及改善方法An-先进工程学刊-中原大学.PDFVIP

先進工程學刊第七卷 第三期 109 Journal of Advanced Engineering Vol. 7, No. 3, pp. 109-114 / July 2012 晶圓探針測試之溫度影響探討及改善方法 An Investigation in Temperature Effects with an Improvement Approach of Wafer Probing Test * 王政龍 籃山明 * Cheng-Lung Wang , Shan-Ming Lan 摘要 在先進製程裡的測試流程，導入高低溫測試已成為測試必要課題。高低溫度 變數下的測試常面臨的問題卻是良率不佳，其成因往往是接觸不良所造成。本文 討論透過銲墊上針痕的觀察，提供業界面對溫度變數下除了設計端元件的溫度特 性曲線之外，指出測試配件與架機設定等測試環境的因素也是影響測試良率的一 個主要因素。藉由透過觀察配件的變形，比較各種造成良率降低的元素間造成的 影響，針對其中某些因素提出更好的解決方案，並提出對策改善環境對良率的影 響。 關鍵詞 ：銲墊刮痕，探針卡，針測行程，探針預熱 Abstract In the test flow of advanced process, testing under high and low temperature has become an essential issue. Testing variables under high and low temperature often confront with the problem of low yield ratio caused by poor contact. Through observation from probe marks on the bonding pad, this study suggests that both the temperature characteristic curve of the components at the design stage and the factors of testing environments, such as testing devices and machine settings, are main causes to affect the yield ratio of testing when facing the temperature variables. After checking the deformation from components and comparing the effects caused by various factors resulting in low yield ratio, a better solution to modify these factors is proposed to