酸性硫酸盐镀铜液分散能力的影响因素及其改善毕业论文.docVIP

毕业论文 酸性硫酸盐镀铜液分散能力的影响因素及其改善 Acidic Sulfate Copper Plating Liquid Dispersion Ability of the Influence Factors And Improvement 摘 要随着经济的发展以及科学技术的提高，越来越多的对电镀金属层的品质要求也越来越高，）；（2）阴极和阳极间的距离（）；（3）镀液极化率的大小；④镀液的电阻率（）。进而提出改善方案如下：（1）改变电解槽的形状；加大零件与阳极间的距离，采用象形阳极法和保护阴极法；（2）让零件在电解槽中均匀排布；（3）选择适当的络合剂和添加剂，提高阴极极化降；（4）低硫酸盐镀液的电阻率，提高电导率。 关键词：酸性硫酸盐镀液； 阴极电流密度； 分散能力  Acidic Sulfate Copper Plating Liquid Dispersion Ability of the Influence Factors And Improvement Abstract Acidic sulfate copper plating with composition of tube sheet, and the advantages of low cost, convenient maintenance, in add copper plating brightener, can plating coating parts of high quality. With the improvement of the development of economy and science and technology, more and more market for plating metal layer quality requirements also more and more high, to control the production parameters and technology conditions in production is particularly important. Acidic sulfate copper plating liquid dispersion are discussed in this paper by factors that influence the ability of the Faraday copper thickness calculation formula, this paper deduce impact acidic sulfate solution plating copper thickness is mainly due to the cathode current density distribution. Then discuss the cathode current density distribution and the dispersion relations, concludes that the distribution of current density and electrolyte solution dispersion force for parallel relationship, found the factors influencing the dispersion ability of plating solution are: (1) the shape of the electrolytic cell and the difference between the far and near the cathode and anode distance (); (2) the distance between cathode and anode (); (3) polarization ratio of the size of the plating solution（）; (4) of the plating solution resistivity (). And then put forward the improvement scheme is as follows: (1) change the shape of the electrolytic cell; More parts with the distance between anode and use hieroglyphic anode and cathode protection method; (2) make parts evenly