芯片模块的能力和过程控制[英文版]2007.pptVIP

* Capability and Process Control of Flip-Chip Module Flip chip wafer After die placement Flip chip die X-Ray photo 76um 16um Solder bump Cu bump Sn Pad Cpd Flip-Chip production： Min Pitch : 130um Bump Diameter: 70um After PKG Substrate Baking Flux Alpha NCX-FD Solder Print SMD Placement Die Placement Reflow Water Cleaning Baking Capacitor 0.01uF Flux Print A FC Wafer Panasonic NM-PC10 Assembleon AX-301 HOVER-DAVICES DDF Technical Devices SMT618 C-Sun Oven Assembleon AX-301 C-Sun Oven FURUKAWA Material Process Equipment Solder paste Alpha WS609 Saponifier Zestron AC205 Assembly Process Fl