【精选】BGA Profile(Tin-Lead).pdfVIP

Intel Confidential Intel Confidential Board Assembly Process Board Assembly Process Environment for BGAs Environment for BGAs (Aligned with Intel BGA and Board (Aligned with Intel BGA and Board Assembly Processes) Assembly Processes) ® ® 1 Intel Confidential Intel Confidential Package Handling and Screen Print Package Handling and Screen Print • Component Handling Exposure Duration – Maximum of 72 hrs out of bag time (IPC Level 4) – Store Tape Reel in dry or nitrogen boxes for extended exposures. – Rebake per Intel Packaging Manual – Low temp (in TR): 192hrs at 40ºC, ≤5%RH (use within 48hrs) – High temp (non-TR): 24hrs at 125ºC • Screen Print – Consistent solder paste volume will have a big impact on your post-reflow defect levels. – Incoming inspection for the correct stencil hole size and stencil thickness. – Post-printing inspection and measurement for paste height and volume. – Frequent stencil checks while in use for clogged holes. – Limit the time that an in-use stencil can be idle in the machine or on the assembly line before it must be cleaned (drying paste can clog holes). ® ® 2 Intel Confidential