纳米铜薄膜氧化反应动力学规律研究InvestigationforKineticsLawof.PDF

2007 年第65 卷 化 学 学 报 Vol. 65, 2007 第15 期, 1521～1526 ACTA CHIMICA SINICA No. 15, 1521～1526 ·研究论文· 纳米铜薄膜氧化反应动力学规律研究 罗宇峰 钟 澄 张 莉 严学俭 李 劲 蒋益明* (复旦大学材料科学系 上海 200433) 摘要 研究了 140 ℃下纳米尺度Cu 薄膜的氧化行为. 采用真空蒸发法以不同沉积速率制备一系列Cu 薄膜, 利用原子 力显微镜(AFM)观察其微观形貌, 选取形貌良好的 Cu 薄膜样品. 采用方块电阻和透射光谱两种方法为表征手段, 测量 16～22 nm 范围内不同厚度Cu 薄膜在140 ℃下完全氧化所需要的时间, 得到了Cu 薄膜氧化反应的动力学曲线, 并利 用X 射线衍射(XRD)分析了氧化产物的晶相结构和成分. 结果表明, 纳米尺度下Cu 薄膜在140 ℃下氧化反应的动力学 表征结果满足特殊的反对数生长规律, 反应产物为Cu2O. 关键词 铜薄膜; 氧化; 动力学表征; 方块电阻; 透射光谱 Investigation for Kinetics Law of Oxidation of a Nano-scale Copper Film LUO, Yu-Feng ZHONG, Cheng ZHANG, Li YAN, Xue-Jian LI, Jin JIANG, Yi-Ming* (Department of Materials Science , Fudan University, Shanghai 200433) Abstract Oxidation behaviour of a nano-scale copper film at 140 ℃ was investigated in this paper. Nano-scale copper films were prepared on glass substrate by vacuum deposition at different depositing rates. Atomic force microscope (AFM) was applied to characterization of the surface morphology of these thin films to choose suitable samples. Kinetics of the oxidation process of the copper films in the thickness range of 16～22 nm at 140 ℃ was studied by using transmission spectrum and sheet resistance methods. The crystal structures and compositions of the oxidation products were analyzed with X-ray diffraction (XRD). The results show that the copper was oxidized to form Cu2O