静态存储器和动态存储器设计简介
Semiconductor Memory Design (SRAM DRAM) Kaushik Saha Contact: kaushik.saha@, mobile-98110-64398 Understanding the Memory Trade The memory market is the most Volatile Cost Competitive Innovative in the IC trade Classification of Memories Feature Comparison Between Memory Types Memory selection : cost and performance DRAM, EPROM Merit : cheap, high density Demerit : low speed, high power SRAM Merit : high speed or low power Demerit : expensive, low density Large memory with cost pressure : DRAM Large memory with very fast speed : SRAM or DRAM main + SRAM cache Back-up main for no data loss when power failure SRAM with battery back-up EEPROM Trends in Storage Technology The Need for Innovation in Memory Industry The learning rate (viz. the constant b) is the highest for the memory industry Because prices drop most steeply among all ICs Due to the nature of demand + supply Yet margins must the maintained Techniques must be applied to reduce production cost Often, memories are the launch vehicles for a technology node Leads to volatile nature of prices Memory Hierarchy of a Modern Computer System By taking advantage of the principle of locality: Present the user with as much memory as is available in the cheapest technology. Provide access at the speed offered by the fastest technology. How is the hierarchy managed? Registers - Memory by compiler (programmer?) cache - memory by the hardware memory - disks by the hardware and operating system (virtual memory) by the programmer (files) Memory Hierarchy Technology Random Access: “Random” is good: access time is the same for all locations DRAM: Dynamic Random Access Memory High density, low power, cheap, slow Dynamic: need to be “refreshed” regularly SRAM: Static Random Access Memory Low density, high power, expensive, fast Static: content will last “forever”(until lose power) “Not-so-random” Access Technology: Access time varies from location to location and from time to time Examples: Disk, CDROM Main Memory Background
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