无铅微焊点焊接温度场仿真分析.pdfVIP

摘 要 随着电子产业的进步，人们对电子产品的要求日益挑剔，无铅焊料的发展便是人们 生活意识提高的表现。在广大的市场竞争力下，电子组装技术朝着高可靠性，高密度，低 成本的方向发展。与传统有铅焊料不同的是，无铅焊料熔点高，成本高，所以分析无铅微 焊点焊接温度场仿真为实际焊接工艺提供参考是有必要的。 本文对小型芯片与PCB板，以及无铅微焊点焊接过程中的温度场进行仿真分析，利 用ANSYS有限元软件，建立了简化过的PCB组件模型，对不同材料施加了不同的导热系数 ，比热，密度以及对流换热系数。模拟了芯片、PCB板以及无铅焊料在预热阶段、保温阶 段、回流阶段以及冷却阶段13个温度区 的温度梯度分布云图和节点温度曲线，并对四 个阶段进行了分析。 本文模拟了无铅微焊点焊接的温度场。所得到的结果可以为无铅微焊点焊接各个参 数的选择提供一定的参考价值。 关键词：无铅微焊点；温度场；PCB ；ANSYS仿真分析 Analysis of welding temperature field simulation of lead-free solder joints Student:JIANG Kong-zhen Teacher:DAI Xuan-jun Abstract：With the development of electronics industry, the demand for the electronic products is becoming increasingly critical. The development of lead-free solder is the performance of the improvement of peoples life consciousness.In the broad market competition, the electronic assembly technology is developing towards high reliability, high density and low cost.Different from the traditional lead solder, the lead-free solder has high melting point and high cost, so it is necessary to analyze the temperature field of lead-free solder joints for the actual welding process. In this paper, the temperature field of the BGA chip and the PCB plate, and the temperature field of lead-free solder joints during welding are simulated.Using ANSYS finite element software, the simplified PCB component model is established, and different heat conduction coefficient, specific heat, density and convection heat transfer coefficient are applied to different materials.To simulate the BGA chip, PCB board and lead-free solder in the preheating stage, holding stage, reflux and cooling stage 13 temperature interval of temperature gradient distribution nephogram and node temperature curve, and has carried on the analysis to the fo