HDI介绍.ppt

HDI介绍 HDI 较PCB优点 轻.薄.短.小! 重量轻 介层薄 传输路径短 布线密度高体积小 噪声少,信赖性高! 雷射孔种类 (就连通方式而言)Interconnected type for laser drill 24 (Conformal Mask)(蚀刻) 25 .(Conformal Mask) (去膜) 26. 雷射钻孔 (Laser Ablation)及机械钻孔 Mechanical Drill (P.T.H.) Laser Microvia (Blind Via) 27. 机械钻孔 (Mechanical Drill) 28. 电镀(Desmear Copper Deposition) 29. 外层线路制作 (Pattern imaging) 压膜(D/F Lamination) 曝光(Exposure) 显影(D/F Developing) 蚀刻 (Etching) 去膜(D/F Stripping) * Lantek * Lantek HDI的说明与简介 DIH: 由于PCB朝向高密度设计于是利用激光技术烧出之微孔做为增层间互连的设计称为HDI (High Density Interconnect) Due to PCB lay out circuit with higher density will be the trend, and therefore the interconnection used microvia so called “HDI”. 高密度之互连板,其一般定义为: 孔径≦150μm或其每一平方英吋之焊点大于130个 一阶盲孔 Plus 1 design 二阶盲孔 Plus 2 design 一般HDI的基本结构(以1+N+1为参考) LASER BLIND BURIED VIA LAY-UP A = THROUGH VIA HOLE (导通孔) B = BURIED VIA HOLE (埋孔) C = One Level Laser Blind Via (雷射盲孔 ) C C D = Two Level Laser Via (雷射盲孔 ) B-STAGE FR-4 Core RCC B A HDI的基本制作流程(以1+N+1为参考): 下料---内层---AOI---棕化---IVH压板---IVH X-RAY 锣边---IVH钻孔---IVH电镀 --IVH塞孔---IVH线路---AOI---棕化---外层压板---外层 X-RAY 锣边---外层钻孔 ---外层 conformal mask---外层激光钻孔---外层电镀---外层线路---外层绿油文字 --- 成型/表面处理---O/S 电测---外观检验 HDI (以1+N+1为参考)示意图 Pre-engineering Pattern imaging Etching Laminating Drilling Cu plating Hole plugging Pattern imaging Lamination Laser Ablation Mechanical drilling Pattern imaging Cu plating Solder Mask Surface Finished Routing Visual inspection Electric test Shipping 1.內层基板 (THIN CORE) Laminate Copper Foil 裁板(Panel Size) COPPER FOIL Epoxy Glass Photo Resist 2.內层线路制作(LPI) Etch Photoresist Photo Resist 3. 內层线路制作(曝光)(Expose) A/W Artwork (底片) Artwork (底片) After Expose Before Expose 4. 內层线路制作(顯影)(Develop) Photo Resist 5.內层线路制作(蝕刻)(Etch) Photo Resist 6.內层线路制作(去膜)(Strip Resist) 7.黑氧化 ( Oxide Coating) /棕化 8. 叠板 (Lay-up) LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 1 LAYER 6 Layer 1 Layer 2 Layer 3 Layer 4 Copper Foil Copper Foil Inner Layer Prepreg(膠片) Prepreg(膠片) 9. 压合 (Lamination) 墊木板 鋁板 10. 钻孔 (Drilling) 11. 电镀Desmear