Chapter_4_矽晶太阳能电池.pdf

Chapter 4 1 Evolution of Wafer Size 2000 1992 1987 1981 1975 1965 50 mm 100 mm 125 mm 150 mm 200 mm 300 mm 2 High Speed Devices Lab. High Speed Devices Lab. 1 Stages of IC Fabrication (solar cell類) Single crystal silicon 1. Wafer Preparation 4. Assembly and Packaging: includes crystal The wafer is cut Scribe line growing, rounding, along scribe lines slicing and polishing. Wafers sliced from ingot to separate each die. A single die 2. Wafer Fabrication Metal connections Assembly Packaging includes cleaning, are made and the layering, patterning, chip is encapsulated. etching and doping. 3. Test/Sort includes Defective die 5. Final Test ensures IC probing, testing and passes electrical and sorting of each die on environmental the wafer. testing. 3