TDSCDMA无线协议（英文版）.doc

3GPP TR 25.834 V4.1.0 (2001-03) Technical Report 3rd Generation Partnership Project; Technical Specification Group Radio Access Network; UTRA TDD Low Chip Rate Option; Radio Protocol Aspects (Release 4) The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented. This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification.Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners Publications Offices.  Keywords UMTS, radio, protocol 3GPP Postal address 3GPP support office address 650 Route des Lucioles - Sophia Antipolis Valbonne - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Internet Contents Foreword 5 1 Scope 6 2 References 6 3 Definitions and abbreviations 6 3.1 Definitions 6 3.2 Abbreviations 6 4 Background and Introduction 8 5 Overview of Physical Layer of TDD Low Chip Rate Option 8 5.1 Frame structure 8 5.2 Burst Types 9 6 Services and Functions of the Physical Layer of 1.28 Mcps TDD 10 6.1 General 10 6.2 Overview of L1 functions 10 6.3 L1 interactions with L2 retransmission functionality 10 7 Model of physical layer of the UE 10 7.1 Uplink models 10 7.2 Downlink models 10 8 Formats and configurations for L1 data transfer 10 8.1 General concepts about Transport Channels 10 8.2 Types of Transport Channels 10 9 UE Simultaneous Physical Channels combinations 12 9.1 1.28 Mcps TDD Uplink 12 9.2 1.28 Mcps TDD Downlink 13 10 Measurements provided by the physical layer 15 10.1 Model of physical layer measurements 15 10.2 UE Measurements 15 10.3 UTRAN Measurements 15 10.3.1 Received SYNC_UL Timing Deviation 15 10.4 Compressed Mode to Monitor 1.28Mcps TDD 15 11 Primitives