Photoresist Coating Methods for the Integration of Novel 3 D RF Microstructures英文文献.pdfVIP

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 13, NO. 3, JUNE 2004 491 Photoresist Coating Methods for the Integration of Novel 3-D RF Microstructures Nga Phuong Pham, E. Boellaard, Joachim N. Burghartz, Fellow, IEEE, and Pasqualina M. Sarro, Senior Member, IEEE Abstract— This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are intro- duced and investigated for the fabrication of 3-D microstructures and RF-MEMS devices. Characteristics of each method as well as its advantage and disadvantages are outlined. A comparison is made to point out the most suitable coating method in terms of complexity, performance and type of application. The potential of these coating methods is demonstrated through several applica- tions such as fabrication of multilevel micromachined structures and RF MEMS devices. [1031] Index Terms—Electrodeposition (ED), lithography for MEMS, patterning 3-D structures, photoresist coating, spray coating. I. INTRODUCTION HE growing interest in the development of microelec- Fig. 1. Schematic drawing of the preparation of the wafers for coating Ttromechanical systems (MEMS) and the increasing use experiments. of truly three-dimensional (3-D) microstructures requires new techniques and processes to fulfill the demand for further minia- of the three coating methods is presented in order to identify the turization and higher integration density. For several MEMS most suitable coating technique for a specific application. applications, patt