USB3.1最新技术及测试方案.pptxVIP

USB3.1最新技术 及测试方案 演讲内容 © Agilent Technologies, 2014 2  Agilent 对最新数字总线标准的跟踪和支持  USB 协会的结构及认证实验室  USB 2.0/3.0 测试的最新变化  USB 3.1 简介  USB 3.1 的发送信号质量测试  USB 3.1 的接收容限测试  电缆、连接器测试  总结 Agilent 对最新数字总线标准的跟踪和支持 Our solutions are driven and supported by Agilent experts involved in international standards committees: Joint Electronic Devices Engineering Council (JEDEC) PCI Special Interest Group (PCI-SIG®) Video Electronics Standards Association (VESA) Serial ATA International Organization (SATA-IO) USB-Implementers Forum (USB-IF) Mobile Industry Processor Interface (MIPI) Alliance And many others We’re active in standards meetings, workshops, plugfests, and seminars . We get involved so you benefit with the right solutions when you need them SuperSpeed USB © Agilent Technologies, 2014 3 Jim Choate USB-IF Compliance Committee USB 3.0 Electrical Test Spec WG Rick Eads PCI-Sig Board Member Brian Fetz DisplayPort Phy CTS Editor VESA Board Member Min-Jie Chong SATA 6G / PHY / LOGO Contributor SATA-IO Gold Suite Lead The Agilent Infiniium Scopes team maintains engagement in the top high tech standards organizations Perry Keller JEDEC Board Member Agilent数字总线标准专家组 © Agilent Technologies, 2014 4 USB接口设备的发展 USB is the most successful interface in the history of PC Device charging over USB has become a major consumer feature USB installed base is 10+ billion units and growing at 3+ billion units a year Adoption is virtually 100% in PC and peripheral categories USB-enabled Device Shipments and Forecast: 2009 - 2015 Source: In-Stat, May 2011 2,000,000 1,500,000 1,000,000 500,000 0 2,500,000 4,000,000 3,500,000 3,000,000 4,500,000 5,000,000 2009 2010 2011 USB Low or Full Speed 2012 2013 2014 USB High Speed 2015 USB SuperSpeed © Agilent Technologies, 2014 5 Units in Thousands 1 Billion 77M 436M USB协会（Implementers Forum）的组织结构 USBIF Board Members Intel, NEC, HP, Microsoft, ST-Ericsson, LSI Agilent Active Membership Marketing WG Device WG CabCon WG Compliance Committee USB Test Specs