术语ic封装-电子工程专辑.pdfVIP

1BGA(ball grid array) LSI (PAC)200LSI QFP()1.5mm 360 BGA 31mm 0.5mm 304 QFP 40mm BGA QFP Motorola BGA ()1.5mm 225LSI 500 BGABGA Motorola OMPACGPAC(OMPAC GPAC) 2BQFP(quad flat package with bumper) QFP () ASIC 0.635mm84 196 (QFP) 3PGA(butt joint pin grid array) PGA (PGA) 4C (ceramic) CDIP DIP 5Cerdip ECL RAMDSP() Cerdip EPROM EPROM 2.54mm8 42DIP G(G ) 6Cerquad QFPDSP LSI Cerquad EPROM QFP 1. 5 2W QFP 35 1.27mm0.8mm0.65m m0.5mm 0.4mm 32 368 7CLCC(ceramic leaded chip carrier)