电铸微小金结构关键技术研究-机械工程(微机电系统及微细制造)专业论文.pdf.docxVIP

摘要微小零件在航空航天工业、科学研究等领域的应用越来越广泛。然而用常规机加工方法难 以得到厚度在几十微米到几百微米的微小零件，基于 SU-8 胶的 UV-LIGA 技术则是一种低成本、 高精度精确制造微小零件的技术，利用该技术能够制造出复杂形状的金属微零件。本文利用UV-LIGA 技术对制备纯金微小零件进行研究，主要工作如下：（1） 对 300μm 厚 SU-8 胶的光刻工艺参数进行优化。研究了光刻工艺中匀胶、前烘、后 烘的具体工艺过程、出现的问题以及解决方法，确定了匀胶、前烘、后烘具体参数；研究了曝 光参数和显影时间对胶模线宽的影响，优化得到了合理曝光参数和显影时间。（2） 采用正向冲液电铸技术进行纯金微小零件电铸工艺研究。研究了电流密度、流速及 阴阳极间距对纯金微小零件表面质量的影响。确定了试验所用电流密度及电铸时间，获得了优 化的流速和阴阳极间距参数组合。（3） 对 SU-8 光刻胶的溶胀性进行研究。采用分步电铸方法对电铸过程中的溶胀性进行研 究，得到了 SU-8 胶在基片约束下的溶胀规律。采用增设牺牲通道的方法对溶胀性进行控制，得 到了优化的掩模图形。（4） 对如何精确控制纯金微小零件关键尺寸进行研究。采用增设牺牲通道并结合过曝光 和线宽补偿工艺对电铸过程中的微小零件尺寸进行控制，优化得到了 UV-LIGA 技术制备尺寸合 格微小金结构工艺。关键词：UV-LIGA，纯金微小零件，溶胀性，牺牲通道IAbstractThe application of micro parts in the aerospace industry, scientific research is becoming more and more widespread. Because of good ductility, micro parts are difficult to machine with traditional machining method. As a low-cost manufacturing micro-parts technology, The metal micro parts with complex shape can be manufactured easily by UV-LIGA technology. So UV-LIGA technology based on SU-8 photoresist is introduced to fabricate gold micro parts. The following works have been done:（1） Parameters have been researched and optimized based on the SU-8 photoresist （300microns） . The processes of spinning, soft baking and PEB have been researched. The parameters have been optimized and the problems have been solved. The influence of exposure energy and developing time base on SU-8 photoresist to line width have been researched. The experiment is conducted to optimize the parameters.（2） Electroforming process of pure gold micro parts is researched by using forward flushingfluid. The effect of liquid outlet shape, current density , velocity, distance between anode and cathode to surface quality of pure gold micro parts are studied. The optimum parameters of current density, electroforming time are chosen. Optimizing parameters of the best velocity and distance between anode and cathode are acquired.（3） The law of swelling has been studied. The law of swelling