电子企业之 无铅焊料与无铅工艺技术-1 (NXPowerLite).ppt

CEPREI 中国赛宝实验室 Lead Consumption (5 million tons/yr) by Products 6.3.1. 焊料无铅化的推动力 6.3.2 焊料无铅化进程 6.3.3 再流焊选用的无铅焊料体系 6.3.4 波峰焊选用的无铅焊料体系 6.3.5 手工焊选用的无铅焊料体系 6.3.6 Sn-Ag-Cu的选用组成比例 6.3.7 元器件引线脚镀层无铅化 6.3.8 实施无铅工艺需考虑的技术问题 6.3.9 产品无铅化难题的解决期限 7 典型无铅工艺 无铅制程工艺准备： 无铅元器件选用与评估 PCB选用与评估 材料（助焊剂、焊料、锡膏）等评价 设备评估 工艺优化 6.2 北美工艺发展进程（2） Nortel Nelworks Nortel Networks (formerly Nortel Technology) has produced approximately 500 leadfree Meridian phones at four different sites across North America and Europe. They chose the eutectic Sn-0.7%Cu to replace Sn-Pb solder for both surface mount and though-hole component connections. Motorola Ford Motor Company Texas Instruments ...it is now possible to achieve a totally Pb-free solder joint Overall the Sn-Ag (96.5/3.5) solder has been found to be a suitable replacement for Sn-Pb solder. 6.3 欧洲无铅工艺发展进程 5.1.3塑料封装器件潮湿回流敏感度评价（1） 5.1.3塑料封装器件潮湿回流敏感度评价（2） 5.1.3塑料封装器件潮湿回流敏感度等级评价（4） 等级 最低耐受时间(Floor Life)[注] 试验要求 时间 条件 时间(h) 条件 1 无限制 ?30℃/85%RH 168 85℃/85%RH 2 1年 ?30℃/60%RH 168 85℃/60%RH 2a 4周 ?30℃/60%RH 672 30℃/60%RH 3 168小时 ?30℃/60%RH 192 30℃/60%RH 4 72小时 ?30℃/60%RH 96 30℃/60%RH 5 48小时 ?30℃/60%RH 72 30℃/60%RH 5a 24小时 ?30℃/60%RH 48 30℃/60%RH 6 标签上的时间 ?30℃/60%RH 标签上的时间 30℃/60%RH 潮湿敏感损伤 5.1.3塑料封装器件潮湿回流敏感度等级评价（5） C-SAM检测 5.2 材料及其兼容性问题Materials compatibility Another important technological issue is the compatibility of fluxes, board finishes and component finishes with lead-free solders. (i) Fluxes (ii) Board finishes (iii) Components finishes The SnAgCu alloy is not compatible with Ag/Pd which exhibits very poor solderability. SnCu is compatible with OSP and Sn/Pb HASL finishes. SnAgCu alloy is compatible with Sn, Ag, Au and (OSP) finishes. 5.2.1 PCB Pad－Finishes－1 OSP Benzotriazole Imidazole Benzimidazole (substituted) Preflux (rosin/resin) Ni/Au Electrolytic Ni/Au, or EG Electroless Ni/Electroless (immersion) Au, or ENIG Electroless Ni/Electroless (autocatalytic) Au Electroless Ni/Electroless (subst