风冷半导体空调的散热问题.pdfVIP

34 1 Vol. 34 No . 1 2008 2 Jour nal of L an hou Univ ersity of T echnolo gy Feb. 2008 : 2008) 风冷半导体空调的散热问题 徐立珍, 李 彦, 秦 锋, 陈昌和 ( , 100084) : 设计由两组半导体模块组成的半导体空调系统, 整个系统输入功 为170 W, 制冷空间为600 mm 600 mm 600 mm, 性能系数 COP 为0. 62. 实验结果表明, 制冷实验20 min 后, 制冷空间的温度下降了11 . 同时探讨不 同储冷块对实际制冷量的影响, 结果表明, 半导体热电堆存在合适的储冷块厚度. T EC 112708 型半导体制冷片在 12 V2. 8 A 工况下运行时, 储冷块厚度为10 mm 时可以得到较大的实际制冷量. : 半导体空调; 制冷量; COP; 储冷块 : T K5 : A Heat sinking problem in aircooled semiconductive airconditioning XU Lihen, LI Yan, Q IN Feng, CH EN Changhe ( Key Laboratory of Thermal Science and Pow er E ngineering, Ministry of Education of China, Tsinghua U niver sity, Beijing 100084, Ch ina) Abstract: Sem iconductive airco nditioning system com posed of tw o sets of semiconductive m odules w as designed. Input pow er of overall sy stem w as 170 W, refrig er ator y space600mm 600mm 600mm , and coefficient of perform ance COP0. 62. Experimental r esult show ed that , 20 min after the beg inning of re frig eratory test , the temperature of refrigeratory space reduced by 11 . M eanw hile, the influence of dif f erent coolant blocks on actual refrigeratory amount , and it w as show ed that there w ould be an appropriate thickness of r efrigeratory block for the semico nductiv e ther moelectric pile. When such pile of T EC112708 ty pe ran at 12 V and 2. 8 A, w ith its thickness of 10 mm, a greater refr ig er ation capacity could be obtained. Key words: therm oelectric air conditioner ; r efrigeratio n capacity ; COP; space block 20 60 , , . . , , : . , [ 5~ 7]