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晶体硅的相关论文
Research on The Explosive Impact Vibration Damage Model of Electronic Equipment Based on ANSYS/LS-DYNA
SHI Quan,TIAN Qing-wei,WANG Guang-yan,HU Qi-wei(Department of Management Engineering,Shijiazhuang Mechanical Engineering College, Shijiazhuang Hebei 050005,China)
Abstract: The thesis designed a basic simulation project on the explosive vibration damage of electronic equipment.Found a two dimensional model including the explosive,the ground,the elastic body and the electronic equipment with ANSYS/LS-DYNA.Acquired a lot of data corresponding to the explosive impact vibration characteristic about the response acceleration,response displacement,effective stress of the electronic equipment. Lastly,the method which found the comprehensive simulation model and analyze on the explosive vibration damage simulation problem with ANSYS/LS-DYNA software is verified the possibility.
Key words: Explosive impact vibration;Electronic equipment;Damage;Modeling;Orthogonal experimenIn modern wars, the explosive impact vibration has already become one of the most important reasons of the damage of electronic equipment. according to statistics, the ratio can be up to 50 percent to 60 percent because of the mechanical vibration and the explosive impact vibration. However, the explosive dynamics processes are greatly complicated and affected by external factors (for example, explosive property, distance from the surge, ground medium etc.) It is too difficult to get an accurate analytic model. At the present time,the studies of shock and vibration impacting on the digital products are mainly confined to the test mode of the direct imposing the equivalent load of local sine or square wave on the local of the individual components and neglect the synthesized effect of the factors like the surge property, the transmitting medium and so on, hence it has great limitations.the paper adopts ANSYS/LS-DYNA FSI technology, considers over the environmental factors of explosive impact vibration, s
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