pcb流程幻灯片.ppt

* * * * * * * * * * * 鍍錫: plating tin 目的:在鍍完二次銅的表面鍍上一層錫保護，做為蝕刻時的保護劑 Purpose :to deposit a temporary etch resist of tin on top of all copper plated areas. 重要原物料：錫球 main material: tin ball 乾膜 二次銅 保護錫層 外層课PTH O/L Section PTH Introduction * * 線路蝕刻流程: line eating flow 上板 剝膜 蝕刻 剝錫 收板 going up board striping eating strip tin going down board 制程目的:將電鍍OK板做后加工處理,完成線路 Purpose: plated OK copper board in order to having line 主要物料:NAOH,蝕刻液,剝錫液 Main material: NAOH 外層课PTH O/L Section PTH Introduction * * 剥膜:strip 目的:將抗電鍍用途之幹膜以藥水剥除 To remove the photopolymer plating resist 重要原物料：剝膜液(NaOH) main material: NAOH 線路蝕刻:etching 目的:將非導體部分的銅蝕掉 重要原物料：蝕刻液(氨水) Purpose: To remove all unwanted copper previously coverde with plating resist so that the pattern main material: NH3.H2O 二次銅 保護錫層 Protect tin layer 二次銅 保護錫層 底板 外層课PTH O/L Section PTH Introduction * * 剥錫:strip 目的:將導體部分的起保護作用之錫剥除. purpose: to strip tin so that the underlying copper . 重要原物料:HNO3+H2O2兩液型剥錫液 Main material: HNO3+H2O2 二次銅 secondly platted copper 底板 LAMINATE BOARD 外層课PTH O/L Section PTH Introduction * * electric test The PCB test fixture should have a sufficient number of test pins to perform the testing in one turn. 中檢课介绍 Inspection Section Introduction * * 防焊(Solder Mask) Purpose: during machine soldering to prevent solder bridging by masking off all areas of the pattern not to be soldered and leaving open areas that are to be soldered. During machine soldering ,to prevent solder from flowing through via holes and causing short-circuits by damaging the insulation lacquer of components mounted across via holes. To establish insulation between components and underlying tracks or ground planes so that possible short-circuits can be avoided. 防焊课介绍 S/M Section Introduction * * 前处理 preliminary treatment 目的：去除表面氧化物，增加板面粗糙度，加强板面油墨附着力。 purpose: remove the surface copper oxide substance, increase copper roughness ,strengthen the ink appendiculation on the boa