快速凝固对sn-rapid solidification of sn.docxVIP

A Abstract IV IV electronic products, the rapid solidification solder has better stability and stronger antioxidant capacity. The study on solder force shows that the faster of the cooling and solidificating speed, the bigger of the force of wetting force. The max wetting force Fmax for 0.85mN which is the fastest cooling speed N11 is far larger than the Fmax for 0.48mN. With the increasing speed of cooling and solidifacating of the solder, the solder wetting stability gradually would reduce and the wetting stability of the mother material of 0.985 reduced to 0.847 of N11. However, the speed of condensing does not change the wetting time significantly. The study on the solder micro-hardness shows that with the solder alloy cooling solidification rising up, the micro-hardness of solder appears to be a rising linear trend. Compared with mother material, the hardness of the suction casting and melt-spinning samples have improved significantly. The hardness of the alloy has closely related with the organization of the alloy. On the condition of rapid solidification, the tiny alloy crystal particles show up.. Rich Cu phase Cu6Sn5 and rich Ag phase Ag3Sn particles are distributed among the separated crystals, which plays a important role in fine-grain strengthening and dispersion strengthening which are the main reason to improve the solder alloy mechanics properties. The study of the solder joint’s reliability shows that: In the same size of solder joint, rapid solidification solder joint, appearance of weld is better; Along with the increase of solidification rate, the faster solidification rate of solder is, the narrower the melting process is, the stronger the wetting ability. During the soldering process, solder show the better spreading and wetting ability, the interaction between solder and copper material is better, the intermetallic compounds are finer and more distributing in the rapid solidification solder joint, which makes shear strength of the joint higher.