迎接数字化通信时代挑战.pptVIP

知识构架 数字通信系统 模拟信号的数字化 数字信号处理 信源编码 MPEG-4视频编码原理 H.261视频编码原理 MC 帧差编码原理 MPEG－2音频压缩编码标准 信道编码 信道编码1 信道编码2 数字电子技术—计算机大厦的砖瓦 空中的数字无线电波 数字信道的多路复用 无线电频谱 高频电子线路 数字通信的实现 Architecture Overview Overview Technically Topology Radio/Baseband Protocol stack ModulesSilicon Development Kits Qualification World Penetration Forecast Worldwide Sales 2005 The Future? Mobile phones is by far the largest segment within Mobile Devices 250 million mobile phones will be sold year 2000 630 million mobile phones will be sold year 2005 Desktop PCs is the largest segment in Desktop Devices 80 million desktop PCs will be sold year 2000 140 million desktop PCs will be sold year 2005 Cordless phones is the largest segment in Consumer Electronics Devices 150 million cordless phones will be sold year 2000 350 million cordless phones will be sold year 2005 What does Bluetooth do for you? “Design a radio to replace the cable and its connectors…” Design Goals Small implementation size Low implementation cost Low power consumption Secure and robust for open ISM band Challenges Fast frequency hopping Single chip integration Unprecedented Cross Industry Commitment Special Interest Group Ericsson, IBM, Intel, Nokia and Toshiba And today there are more than 2000 Bluetooth adopters... Technically Speaking . . . Bluetooth Module Technical Features 2.4 GHz ISM Open band Globally free available frequency, 89 MHz of spectrum available FFH/DS Hybrid Radio 10 -100 m range, personal bubble 8 active devices per piconet (share datarate) Up to 10 piconets in bubble (full datarate) 1 Mbps gross rate Future version: 2 Mbps Simultaneous voice/data capable 432 Kbps (full duplex), 721/56 Kbps (asymmetric) or 3 simultaneous full duplex voice per piconet (CVSD@64 Kbps). or a combination of data and voice Battery Life Time Estimates calculated with 600 mAh battery and internal amplifier, power will vary with implementation and application Low power consumption Standby current 0.3 mA 3 months Voice mode 10 mA (