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ECS Transactions, 33 (3) 459-466 (2010)
10.1149/1.3481634 © The Electrochemical Society
Atomic-Layer-Deposited High-k Dielectric Integration on Epitaxial Graphene
P.D. Ye, A.T. Neal, T. Shen, J.J. Gu, M.L. Bolen, and M. A. Capano
School of Electrical and Computer Engineering and Birck Nanotechnology Center,
Purdue University, West Lafayette, IN 47907, U.S.A.
The scaling of silicon-based MOSFET technology beyond the
22 nm node is challenging. Further progress requires new channel
materials such as Ge, III-V semiconductors, carbon nanotubes
(CNTs) and graphene. Perfect top-gate dielectric stacks are needed
in order to sustain their potential device performance for carbon
nanoelectronics. Due to the inert nature of carbon surfaces of
CNTs and graphene, the challenges and current work on atomic-
layer-deposited (ALD) high-k/CNTs and graphene integration are
reviewed. The research work performed at Purdue University on
ALD high-k integration on epitaxial graphene on SiC is
summarized.
Introduction
The continuous device scaling and performance improvements required by the
International Technology Roadmap of Semiconductors (ITRS) are facing a grand
challenge as conventional Si CMOS scaling comes to its fundamental physical limits. As
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