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英文文电视遥控器外壳的注塑模设计
SMT Process Specification
Contents
1 SHIPPING, STORAGE and PRODUCTION ENVIRONMENT 4
1.1 General 4
1.2 General shipping and storage conditions 5
1.3 Storage and handling conditions for solder paste 6
1.4 Storage and handling conditions for printed wiring boards [PWBs] 6
1.5 Storage conditions for underfill epoxy materials 7
1.6 Shelf life time for different component categories 8
1.6.1 Expired material handling 8
1.7 Moisture sensitivity levels 8
1.8 Drying (baking) moisture sensitive devices 9
1.8.1 Drying (baking) restrictions 9
1.9 Dry storage conditions 10
2 STENCIL PRINTING PROCESS SPECIFICATIONS 11
2.1 Paste specification 11
2.2 Squeegee 12
2.3 Stencil 12
2.4 Support tables 13
2.5 Printing process parameters (stencil printing) 13
2.6 Print result validation 14
3 Process control and monitoring 15
3.1 Automated Optical Inspection, AOI 15
3.2 Location of the machine in the production line 15
3.3 Utilization of inspection results 15
3.4 Component and paste alarm limits 16
3.5 Specification limits for capability analyses 17
4 PLACEMENT PROCESS SPECIFICATIONS 18
4.1 Nozzles 18
4.2 Feeders 18
4.3 NC-Programs 18
4.4 Part Data / Vision processing 19
4.5 Placement process management data compatibility table 19
5 Dipping process 20
5.1 Dipping flux specification and handling instructions 20
5.1.1 Storage and handling instructions 20
5.1.2 Flux specifications 20
5.2 Dipping process specifications 21
5.2.1 Dipping device 21
5.2.2 Dipping process parameters 21
6 Reflow soldering profile measurement 22
6.1 Profile measurement equipment 22
6.2 Reflow profile measurement method with standard calibration board 22
7 Standard, lead containing soldering process 23
7.1.1 Recommended reflow oven settings 24
8 Lead free soldering process 25
8.1 Reflow profile definition for Pb-free process 25
8.2 General Pb-free reflow soldering profile specification 26
8.3 Basic profile specification for standard calibration board in Pb-free process 27
8.4 Start-up settings for Pb-free process 29
8.
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