电路板中无铅焊点失效分析研究现-学士学位论文外文翻译.docVIP

题 目: 电路板中无铅焊点失效分析研究现状学 生 姓名：郑某某指 导 教师：王某某系（院）别：某某系专业、班级：某某学专业1002班填 表 时间：二○一四年三月xx科技师范学院某某系 制 Effect of thermal aging on the interfacial structure of SnAgCusolder joints on CuWeiqun Peng a, Eduardo Monlevade b, Marco E. Marques bAbstractInterfacial structure plays a great role in solder joint reliability. In solder joints on Cu, not only is Kirkendall voiding at the solder/Cuinterface a concern, but also the growth of interfacial Cu–Sn intermetallic compounds (IMCs). In this work, evolution of microstructure in the interfacial region was studied after thermal aging at 100–150 _C f