电子封装技术专业本科培养计划6.docVIP

华中科技大学本科专业人才培养计划PAGE ·PAGE 99·电子封装技术专业本科培养计划Undergraduate Program for Specialty in Electronics Packaging Technology一、培养目标 Ⅰ. Educational Objectives 本专业培养具备材料科学与工程学科、电子制造学科以及信息学科有关的基础理论知识与应用能力，能够从事电子制造与电子材料等应用领域的科学研究、教学、技术开发、设计制造、试验研究、企业管理和经营等方面工作，适应市场经济发展的富有创新精神的高素质复合型人才。特别针对电子制造业培养急需的专门人才。This program prepares students a thorough knowledge in material science and engineering, electronics manufacturing technology and information sciences. With skills of combining electronics materials and manufacturing, students will be competent to do research, development, teaching and management jobs. 二、基本规格要求 Ⅱ.Skills Profile本专业主要学习材料工程及电子制造科学与技术两个领域的基础理论和应用技术，毕业生应获得如下几个方面的知识和能力：1. 具有较为扎实的自然科学基础，较好的人文、艺术和社会科学基础及素质；2. 系统掌握微电子与材料工程领域的宽广的理论基础知识和应用技术，主要包括力学、机械学、电工与电子技术、固体电子学、材料学、材料加工工程等；3. 系统学习电子制造专业领域的理论基础知识和应用技术，主要包括电子制造技术基础、半导体工艺技术、电子封装与组装技术、电子工艺材料与设备、电子产品可靠性等；4. 具有电子制造专业所需的编程、分析、实验、测试、文献检索等基本技能；5. 熟悉本专业领域各个方向的专业技术，了解学科的前沿及发展趋势；6. 具有较好的外语能力、自学能力、富有创新精神，具备较高综合素质。As a student of this program, you will gain：Solid grounding in both natural sciences and humanities arts；Excellent basic training in electronics，materials engineering；Skills of electronics manufacturing, semiconductor processing, electronic packaging and assembling technology, electronic materials and equipments, and electronic products reliability；Skills of programming, analyzing, experimenting, testing, and data researching in electronic manufacturing；Knowledge of two or three specializations of the subject matter in electronics manufacturing and material processing related areas, and understanding of its trend and current stage of development；Mastery of a foreign language and Self-learning ability and innovative thinking.三、培养特色III. Educational Feature材料工程与电子制造技术相结合，拓宽专业方向，使培养的毕业生更加适应社会This program integrates the knowledge of material engineering with that of electronic manufacturing. It also broadens its specialty field in order to produce visible graduates who are more adaptable to the society.四、主干学科