Sn-ZnCu焊点剪切强度与界面显微组织分析 (毕业论文).docVIP

哈尔滨工业大学工学硕士学位论文 - PAGE II - - PAGE III - Sn-Zn/Cu焊点剪切强度与界面显微组织分析 摘要 由于含铅物质对人体和环境的危害，钎料无铅化已成为电子封装连接材料发展的必然。从熔点、毒性、资源和价格来看，Sn-Zn系无铅焊料是最佳选择。目前针对其润湿性、耐蚀性及疲劳性差等问题的研究已取得了很大进步。Sn-Zn系列仍是现在正在研制的各种无铅焊料中最有前途的一种。 目前，对Sn-Zn系焊料的剪切性能及界面显微组织的研究相对来说还比较少，所以本文以Sn-9Zn钎料与Cu基板的焊接结构作为研究对象，以剪切机、扫描电镜和金相显微镜等手段对Sn-9Zn/Cu钎焊接头（焊球直径分别为750μm、1000μm、1300μm）的剪切强度和界面显微组织进行分析研究，得出以下结论： 随焊球直径的增大，Sn-9Zn/Cu钎焊接头剪切强度呈V字形变化，先减小后增大。在对剪切断口形貌的观察上，分析得出随焊球直径的增大，界面处韧窝由密而深变得疏而浅，并且断口位于焊料上。在对界面显微组织进行观察时，从总体上看，随BGA球直径的增大，IMC层厚度增加。BGA球直径从750μm增加到1000μm时，IMC层厚度增大的趋势很快，当BGA球直径从1000μm增加到1300μm时，IMC层厚度增大的趋势变得缓慢起来。对于不同尺寸的焊点，界面微观组织的成分基本相同.显微组织主要由Cu-Zn化合物、Cu5Zn8化合物和富Sn相组成。随着与Cu基板距离的增大，依次出现Cu-Zn化合物、Cu5Zn8化合物、富Sn相，并且各相在一定范围内共同存在。 关键词 无铅钎料;Sn-9Zn;尺寸效应;剪切强度 Shear strength and interface microstructure analysis of Sn-Zn/Cu solder joints Abstract Because of lead materials is harmful to human body and the environment, the connection materials which is used for electronic packaging has become a necessity as the development. At the point of melting point, toxicity, resources and price, Sn-Zn lead-free solder is the best choice. At present time, the research for Sn-Zn lead-free solder has made much progress in wettability stain resistance and bad fatigability. Sn-Zn solder which comparied with other series of solders is still the most promising. Now the research for Sn-Zn solder in shear performance and microstructure is relatively less. So in this paper the object of the research is the Sn-9Zn solder and Cu substrate welding structure, using cutting machine, scanning electron microcopy and metallographic microscope to study Sn-9Zn/Cu brazed joint (the diameter of the soldered ball is 750μm、1000μm、1300μm),including the shear strength and interface microscopic structure, the conclusions are as follows: with the increase of the diameter of solder ball, the increase trend of shear strength of Sn-9Zn/Cu brazed joint represent V, that is the tends to decrease firstly and then increase. At the same time, the observation and analysis of